Hogan's Heroes: Learning from Apple - Panelists will discuss what the electronics industry has learned from Apple.
Jack Guedj, president and CEO, Tensil....." />
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Tensilica Discusses IP Core Technology on Multiple Panels at DAC 2012

(June 04, 2012)

SANTA CLARA, CA -- (Marketwire) -- 06/04/12 -- Tensilica, Inc., the leader in dataplane processor IP cores, will participate in three panel discussions at the Design Automation Conference (DAC) 2012.

Hogan's Heroes: Learning from Apple - Panelists will discuss what the electronics industry has learned from Apple.
Jack Guedj, president and CEO, Tensilica
Tuesday, June 5, 10:00 - 11:00 a.m.
Booth #310

System Models -- Does One Size Fit All? - Panelists will review different aspects of system modeling and discuss which abstraction levels best address specific user requirements.
Andrea Kroll, senior product specialist, Tensilica
Tuesday, June 5, 1:30 - 3:00 p.m.
Booth #305

IP Packaging -- What's in it for me? - This panel will discuss the pros and cons of IP standardization from various perspectives and explore the rate of adoption of the IP-XACT standard.
Grant Martin, chief scientist, Tensilica
Wednesday, June 6, 2:30 p.m.
Duolog Booth #1520

It's the Software, Stupid! Truth or Myth - Industry experts will debate three opposing views on the importance of software in product differentiation.
Dr. Chris Rowen, founder and CTO, Tensilica
Thursday, June 7, 1:30 - 3:00 p.m.
Booth #305

About DAC
The Design Automation Conference (DAC) is recognized as the premier event for the design of electronic circuits and systems, and for electronic design automation (EDA) and silicon solutions. A diverse worldwide community representing more than 1,000 organizations attends each year, represented by system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

About Tensilica
Tensilica, Inc. is the leader in dataplane processor IP cores. Dataplane processors (DPUs) combine the best capabilities of DSPs and CPUs while delivering 10 to 100x the performance because they can be optimized using Tensilica's automated design tools to meet specific and demanding signal processing performance targets. Tensilica's DPUs power SOC designs at system OEMs and seven out of the top 10 semiconductor companies for designs in mobile wireless, telecom and network infrastructure, computing and storage, and home and auto entertainment. For more information on Tensilica's patented, benchmark-proven DPUs visit www.tensilica.com.

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Erika Powelson
Powelson Communications for Tensilica
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