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Tensilica Adds Support for Dynamic Resolution Adaptation Audio Standard to HiFi Audio DSP LibraryAll HiFi Products Now Support the DRA Standard, Which Is China's Approved National Audio Standard (April 23, 2012)
SANTA CLARA, CA -- (Marketwire) -- 04/23/12 -- Tensilica®, Inc. today announced that it has added support for the Dynamic Resolution Adaptation (DRA) standard to its library of over 100 audio encoders, decoders and sound enhancement packages for its popular HiFi Audio DSP (digital signal processor) family. Now all products that include the HiFi Audio DSPs can be used to support the standard approved by the People's Republic of China as the National Audio Standard (GB/T 22726-2008) for multi-channel audio decoding. Tensilica has delivered the HiFi DRA decoder to a number of Tier 1 system OEMs and semiconductor companies.
"DRA is an approved optional audio codec standard for Blu-ray Disc audio, adopted as an audio codec for the Chinese Multimedia Mobile Broadcast (CMMB) standard," stated Larry Przywara, senior director of multimedia marketing. "It is an important audio standard for terrestrial digital TV, IPTV, internet streaming, and Blu-ray Disc applications in China."
Tensilica's HiFi Audio DSPs are the leading licensable audio DSP IP cores, licensed by over 45 customers including five of the top 10 semiconductor manufacturers and many leading system OEMs. The HiFi Audio DSPs support over 100 audio and voice codecs with very efficient processing at low power. The HiFi Audio DSPs are part of Tensilica's growing line of dataplane processors (DPUs) that efficiently do the challenging, compute-intensive tasks in system on chip (SOC) designs.
Tensilica, Inc. is the leader in dataplane processor IP cores. Dataplane processors (DPUs) combine the best capabilities of DSPs and CPUs while delivering 10 to 100x the performance because they can be optimized using Tensilica's automated design tools to meet specific and demanding signal processing performance targets. Tensilica's DPUs power SOC designs at system OEMs and seven out of the top 10 semiconductor companies for designs in mobile wireless, telecom and network infrastructure, computing and storage, and home and auto entertainment. Tensilica offers standard cores and hardware/software solutions that can be used as is or easily customized by semiconductor companies and OEMs for added differentiation. For more information on Tensilica's patented, benchmark-proven DPUs visit www.tensilica.com.
- Tensilica and Xtensa are registered trademarks belonging to Tensilica, Inc. All other company and product names mentioned are trademarks and/or registered trademarks of their respective owners.
- Tensilica's announced licensees include: Afa Technologies, ALPS, Aquantia, Astute Networks, AMD, Avision, Bay Microsystems, Brocade, Broadcom, Cavium, Chelsio, Cisco Systems, CMC Microsystems, Conexant Systems, Design Art Networks, EE Solutions, Epson, Fujitsu Ltd., Fujitsu Semiconductor, Huawei, iBiquity Digital, Ikanos Communications, Intel, Juniper Networks, LG Electronics, Lucid Information Technology, Marvell, Maxim, NEC Corporation, Nethra Imaging, Novatek, NuFront, NXP, Olympus Optical Co. Ltd., Panasonic Mobile, Plato Networks, PnpNetwork Technologies, PowerLayer Microsystems, QLogic, Qualcomm Atheros, Renesas, Samsung, Shanghai HDIC, SiBEAM, Sirius XM Radio, Sony, Stretch, TranSwitch Corporation, Triductor Technology, Valens Semiconductor, Validity Sensors, VIA, Victor Company of Japan (JVC), and Wolfson Microelectronics.
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