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NXP Wins Recognition for Excellence in High Performance Mixed Signal Products

NXP USB Microcontrollers and JenNET-IP Recognized in 2011 EDN Hot 100; EDN China Innovation Awards Go to GreenChip SSL Driver IC and LCD Microcontroller (December 20, 2011)

EINDHOVEN, NETHERLANDS -- (Marketwire) -- 12/20/11 -- NXP Semiconductors N.V. (NASDAQ: NXPI) today announced four recent awards received for its High Performance Mixed Signal solutions in Q4 2011.

  • JenNet-IP was selected by EDN as one of the 100 Hot Products of 2011 and was also mentioned as a key enabler of the "Internet of Things" in EE Times' 20 Hot Technologies for 2012. NXP's JenNet-IP network layer software enables ultra-low-power wireless connectivity based on IEEE 802.15.4 (6LoWPAN) for both residential and industrial applications. The 2011 EDN Hot 100 highlights the electronics industry's most significant products of the year based on innovation, significance, usefulness, and popularity.

  • NXP LPC11U00 microcontrollers were also recognized in the EDN Hot 100 Products of 2011, for featuring a "configurable full-speed USB 2.0 device controller as well as a smart card interface." Based on the ARM® Cortex™-M0 processor, the LPC11U00 series offers a compelling replacement for 8- to 16-bit USB microcontrollers.

  • The GreenChip SSL4101 controller IC, which offers professional-grade performance for Solid State LED lighting power supplies received an EDN China 2011 Innovation Award as best product in the Power and Analog category. The SSL4101 is enabling LED adoption into a wide range of professional lighting applications such as high bay and low bay lighting found in warehouses and street lighting, where brightness and dependable illumination are essential.

  • The LPC1800 microcontroller also received an EDN China 2011 Innovation Award as leading product in the Embedded Systems category. At 180 MHz, the LPC1800 is the fastest Cortex-M3 microcontroller available today, and features a unique high-performance memory architecture and innovative system peripherals.

Alexander Everke, executive vice president and general manager of NXP Semiconductors' High Performance Mixed Signal business unit, commented: "We're delighted to receive recognition from the engineering community in the US and China for NXP's innovations in High Performance Mixed Signal. In the lighting market in particular, we are working to accelerate LED adoption, as well as smart lighting applications enabled by JenNet-IP for ultra-low-power wireless connectivity. JenNet-IP is also enabling numerous other applications in home automation and building automation, as our customers explore the potential of connecting hundreds of smart devices via the Internet. In embedded systems more generally, we continue to forge ahead with enabling the migration from 8/16-bit to low-power 32-bit ARM processor-based microcontrollers, and continue to set new benchmarks for performance, peripherals and power efficiency."

About NXP Semiconductors
NXP Semiconductors N.V. (NASDAQ: NXPI) provides High Performance Mixed Signal and Standard Product solutions that leverage its leading RF, Analog, Power Management, Interface, Security and Digital Processing expertise. These innovations are used in a wide range of automotive, identification, wireless infrastructure, lighting, industrial, mobile, consumer and computing applications. A global semiconductor company with operations in more than 25 countries, NXP posted revenue of $4.4 billion in 2010. Additional information can be found by visiting www.nxp.com.

Forward-looking Statements
This document includes forward-looking statements which include statements regarding NXP's business strategy, financial condition, results of operations, and market data, as well as any other statements which are not historical facts. By their nature, forward-looking statements are subject to numerous factors, risks and uncertainties that could cause actual outcomes and results to be materially different from those projected. These factors, risks and uncertainties include the following: market demand and semiconductor industry conditions; the ability to successfully introduce new technologies and products; the end-market demand for the goods into which NXP's products are incorporated; the ability to generate sufficient cash, raise sufficient capital or refinance corporate debt at or before maturity; the ability to meet the combination of corporate debt service, research and development and capital investment requirements; the ability to accurately estimate demand and match manufacturing production capacity accordingly or obtain supplies from third-party producers; the access to production capacity from third-party outsourcing partners; any events that might affect third-party business partners or NXP's relationship with them; the ability to secure adequate and timely supply of equipment and materials from suppliers; the ability to avoid operational problems and product defects and, if such issues were to arise, to correct them quickly; the ability to form strategic partnerships and joint ventures and to successfully cooperate with alliance partners; the ability to win competitive bid selection processes to develop products for use in customers' equipment and products; the ability to successfully establish a brand identity; the ability to successfully hire and retain key management and senior product architects; and, the ability to maintain good relationships with our suppliers. In addition, this document contains information concerning the semiconductor industry and NXP's business segments generally, which is forward-looking in nature and is based on a variety of assumptions regarding the ways in which the semiconductor industry, NXP's market segments and product areas may develop. NXP has based these assumptions on information currently available, if any one or more of these assumptions turn out to be incorrect, actual market results may differ from those predicted. While NXP does not know what impact any such differences may have on its business, if there are such differences, its future results of operations and its financial condition could be materially adversely affected. Readers are cautioned not to place undue reliance on these forward-looking statements, which speak to results only as of the date the statements were made. Except for any ongoing obligation to disclose material information as required by the United States federal securities laws, NXP does not have any intention or obligation to publicly update or revise any forward-looking statements after we distribute this document, whether to reflect any future events or circumstances or otherwise. For a discussion of potential risks and uncertainties, please refer to the risk factors listed in our SEC filings. Copies of our SEC filings are available from on our Investor Relations website, www.nxp.com/investor or from the SEC website, www.sec.gov.


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