Company News: Page (1) of 1 - 04/24/12 Email this story to a friend. email article Print this page (Article printing at MyDmn.com).print page facebook

NXP Reveals World's Smallest Logic Package With the Largest Pads

New "Diamond" Package Solves Critical Space Issues in Mobile Device Design (April 24, 2012)

EINDHOVEN, THE NETHERLANDS and SAN JOSE, CA -- (Marketwire) -- 04/24/12 -- NXP Semiconductors N.V. (NASDAQ: NXPI) today announced the new SOT1226 "Diamond" package -- the world's smallest general-purpose logic package, featuring a unique pad pitch design. Measuring at 0.8 x 0.8 x 0.35-mm, the new SOT1226 is a leadless plastic package 25-percent smaller than the SOT1115, previously the world's smallest logic package, also from NXP.

Despite its smaller package size, the SOT1226 saves engineers time and costs by offering a 0.5-mm pad pitch that is 50-percent larger for easier soldering. Ideally suited for leading-edge portable devices such as smartphones where PCB space is critical, the unique form factor of the Diamond package enables device miniaturization by offering a space-saving logic solution without the added manufacturing costs associated with smaller pad pitch patterns.

Typical manufacturing processes for packages use a small 0.3-mm or 0.35-mm pad pitch, requiring Electronic Manufacturing Services (EMS) and assembly houses to use a step-down mask in order to successfully mount the devices on the PCB. Due to the Diamond package's larger 0.5-mm pad pitch, a step-down mask is not needed during the soldering process, saving costs for the manufacturer. In addition, the larger pad pitch of the Diamond package offers greater contact area, resulting in easier component placement, as well as improved joint strength and robustness, while reducing the risk of short circuits. With larger pad pitches, PCB assemblers can thus avoid costly mistakes such as solder bridging, or the formation of accidental bridges between contacts, which can render electrical devices useless.

"Mobile designers are constantly faced with the challenge of adding more functionality and features into portable devices while using less space, which in turn introduces new challenges," said Kristopher Keuser, director of marketing, Logic business line, NXP Semiconductors. "NXP's new Diamond package is a game-changing solution that allows our customers to design within smaller geometries without increasing manufacturing costs, and to standardize their entire product portfolio. It underscores our commitment to leadership, innovation and understanding of a market that is driven by the need for smaller, cheaper and more reliable solutions."


50 Years of Logic: Pushing the Trend in Miniaturization
NXP Semiconductors is deeply committed to the logic market and continually invests in new process and package technologies, as well as packaging facilities, to offer a leading-edge portfolio. Over the last 50 years, the NXP logic business -- starting as Signetics and then Philips Semiconductors -- has supported growing global demand for logic. As the No. 1 volume supplier in the world, NXP can support the highest volume logic requirements while offering a broad variety of industry-leading package solutions.

Features

  • 5 lead package
  • 0.8 x 0.8 x 0.35 mm
  • 0.5 mm pitch
  • General-purpose Low Voltage CMOS (LVC) and Advanced Ultra-low Power (AUP) CMOS logic functions all available in the world's smallest package

Availability
Samples of logic devices in SOT1226 are already shipping to lead customers and will be available for volume shipping in June 2012.

Links

About NXP Semiconductors
NXP Semiconductors N.V. (NASDAQ: NXPI) provides High Performance Mixed Signal and Standard Product solutions that leverage its leading RF, Analog, Power Management, Interface, Security and Digital Processing expertise. These innovations are used in a wide range of automotive, identification, wireless infrastructure, lighting, industrial, mobile, consumer and computing applications. A global semiconductor company with operations in more than 25 countries, NXP posted revenue of $4.2 billion in 2011. Additional information can be found by visiting www.nxp.com.

Forward-looking Statements
This document includes forward-looking statements which include statements regarding NXP's business strategy, financial condition, results of operations, and market data, as well as any other statements which are not historical facts. By their nature, forward-looking statements are subject to numerous factors, risks and uncertainties that could cause actual outcomes and results to be materially different from those projected. These factors, risks and uncertainties include the following: market demand and semiconductor industry conditions; the ability to successfully introduce new technologies and products; the end-market demand for the goods into which NXP's products are incorporated; the ability to generate sufficient cash, raise sufficient capital or refinance corporate debt at or before maturity; the ability to meet the combination of corporate debt service, research and development and capital investment requirements; the ability to accurately estimate demand and match manufacturing production capacity accordingly or obtain supplies from third-party producers; the access to production capacity from third-party outsourcing partners; any events that might affect third-party business partners or NXP's relationship with them; the ability to secure adequate and timely supply of equipment and materials from suppliers; the ability to avoid operational problems and product defects and, if such issues were to arise, to correct them quickly; the ability to form strategic partnerships and joint ventures and to successfully cooperate with alliance partners; the ability to win competitive bid selection processes to develop products for use in customers' equipment and products; the ability to successfully establish a brand identity; the ability to successfully hire and retain key management and senior product architects; and, the ability to maintain good relationships with our suppliers. In addition, this document contains information concerning the semiconductor industry and NXP's business segments generally, which is forward-looking in nature and is based on a variety of assumptions regarding the ways in which the semiconductor industry, NXP's market segments and product areas may develop. NXP has based these assumptions on information currently available, if any one or more of these assumptions turn out to be incorrect, actual market results may differ from those predicted. While NXP does not know what impact any such differences may have on its business, if there are such differences, its future results of operations and its financial condition could be materially adversely affected. Readers are cautioned not to place undue reliance on these forward-looking statements, which speak to results only as of the date the statements were made. Except for any ongoing obligation to disclose material information as required by the United States federal securities laws, NXP does not have any intention or obligation to publicly update or revise any forward-looking statements after we distribute this document, whether to reflect any future events or circumstances or otherwise. For a discussion of potential risks and uncertainties, please refer to the risk factors listed in our SEC filings. Copies of our SEC filings are available from on our Investor Relations website, www.nxp.com/investor or from the SEC website, www.sec.gov.

Image Available: http://www2.marketwire.com/mw/frame_mw?attachid=1959130
Image Available: http://www2.marketwire.com/mw/frame_mw?attachid=1959133

Add to Digg Bookmark with del.icio.us Add to Newsvine


Copyright @ Marketwire

Page: 1


Related Keywords: nxp, logic, package, smallest, sot1226, pads, pitch pad, pitch pads, diamond, leadless, Communications, Smart Phone, USA, Marketwire, , Financial, Shipping, Business, Other,

HOT THREADS on DMN Forums
Content-type: text/html  Rss  Add to Google Reader or
Homepage    Add to My AOL  Add to Excite MIX  Subscribe in
NewsGator Online 
Real-Time - what users are saying - Right Now!

Our Privacy Policy --- @ Copyright, 2015 Digital Media Online, All Rights Reserved