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NXP Drives Miniaturization With Industry's Most Efficient Low-VF Schottky Rectifier for Mobile DevicesFirst Rectifier in 1006-Size Leadless Plastic Package to Deliver Forward Voltage Down to 390 mV (April 04, 2012)
EINDHOVEN, THE NETHERLANDS and SAN JOSE, CA -- (Marketwire) -- 04/04/12 -- NXP Semiconductors N.V. (NASDAQ: NXPI) today launched the most efficient Schottky rectifier available in the ultra-small and flat 1.0 x 0.6 x 0.37-mm plastic SMD package DFN1006D-2 (SOD882D). The 20-V, 0.5-A PMEG2005BELD Schottky barrier rectifier is the smallest on the market with a maximum forward voltage of 390 mV at 0.5-A forward current, offering increased battery life and performance. With high-efficiency electrical characteristics never before reached in this size, the low VF Schottky rectifier is ideal for mobile, battery-driven devices such as smartphones and tablets that need to reduce overall power consumption in limited PCB board space. The ultra-compact Schottky rectifier combines a low forward voltage and a low reverse current of only 50 µA at 10-V reverse voltage and is ideal for backlighting displays in smartphones, MP3 players and tablet PCs.
"Board space inside today's smartphones is very limited. We designed this latest low-VF Schottky rectifier based on customer requests to put the characteristics of products two generations larger into a smaller 1006 (0402)-sized plastic package without sacrificing performance. As a result, we have set a new benchmark for low forward voltage in this small leadless package, offering 20 percent more efficiency than other products available in this size range. To achieve these excellent electrical parameters, we had to optimize the silicon wafer process and package assembly," said Dr. Wolfgang Bindke, product marketing manager for diodes at NXP Semiconductors.
Robust and compact, the PMEG2005BELD features NXP's unique tin-plated, solderable side pads. These tin-plated side pads are attractive to manufacturers because they enable visual inspection of solder joints. Solderable side pads also allow for tighter contact onto the PCB with less tilting and stronger shear force robustness.
- Average forward current: IF(AV) ≤ 0.5 A
- Reverse voltage: VR ≤ 20 V
- Low forward voltage VF ≤ 390 mV at 0.5 A forward current IF
- Low reverse current IR ≤ 50 µA at 10 V reverse voltage VR
- Qualified according to automotive standard AEC-Q101
- Longer battery life due to reduced power consumption, as a result of low forward voltage
- High packing density onto the PCB due to form factor and excellent thermal conductivity
- Permits small distance PCB stacks with high stack density, due to extremely low height of device (0.37 mm)
- Allows optical inspection of solder joints due to tin-plated side pad of DFN1006D-2 (SOD882D) package
The PMEG2005BELD is currently available and in mass production.
- Datasheet PMEG2005BELD Low VF MEGA Schottky barrier rectifier
- Leadless ultra small plastic package DFN1006D-2 (SOD882D)
About NXP Semiconductors
NXP Semiconductors N.V. (NASDAQ: NXPI) provides High Performance Mixed Signal and Standard Product solutions that leverage its leading RF, Analog, Power Management, Interface, Security and Digital Processing expertise. These innovations are used in a wide range of automotive, identification, wireless infrastructure, lighting, industrial, mobile, consumer and computing applications. A global semiconductor company with operations in more than 25 countries, NXP posted revenue of $4.2 billion in 2011. Additional information can be found by visiting www.nxp.com.
This document includes forward-looking statements which include statements regarding NXP's business strategy, financial condition, results of operations, and market data, as well as any other statements which are not historical facts. By their nature, forward-looking statements are subject to numerous factors, risks and uncertainties that could cause actual outcomes and results to be materially different from those projected. These factors, risks and uncertainties include the following: market demand and semiconductor industry conditions; the ability to successfully introduce new technologies and products; the end-market demand for the goods into which NXP's products are incorporated; the ability to generate sufficient cash, raise sufficient capital or refinance corporate debt at or before maturity; the ability to meet the combination of corporate debt service, research and development and capital investment requirements; the ability to accurately estimate demand and match manufacturing production capacity accordingly or obtain supplies from third-party producers; the access to production capacity from third-party outsourcing partners; any events that might affect third-party business partners or NXP's relationship with them; the ability to secure adequate and timely supply of equipment and materials from suppliers; the ability to avoid operational problems and product defects and, if such issues were to arise, to correct them quickly; the ability to form strategic partnerships and joint ventures and to successfully cooperate with alliance partners; the ability to win competitive bid selection processes to develop products for use in customers' equipment and products; the ability to successfully establish a brand identity; the ability to successfully hire and retain key management and senior product architects; and, the ability to maintain good relationships with our suppliers. In addition, this document contains information concerning the semiconductor industry and NXP's business segments generally, which is forward-looking in nature and is based on a variety of assumptions regarding the ways in which the semiconductor industry, NXP's market segments and product areas may develop. NXP has based these assumptions on information currently available, if any one or more of these assumptions turn out to be incorrect, actual market results may differ from those predicted. While NXP does not know what impact any such differences may have on its business, if there are such differences, its future results of operations and its financial condition could be materially adversely affected. Readers are cautioned not to place undue reliance on these forward-looking statements, which speak to results only as of the date the statements were made. Except for any ongoing obligation to disclose material information as required by the United States federal securities laws, NXP does not have any intention or obligation to publicly update or revise any forward-looking statements after we distribute this document, whether to reflect any future events or circumstances or otherwise. For a discussion of potential risks and uncertainties, please refer to the risk factors listed in our SEC filings. Copies of our SEC filings are available from on our Investor Relations website, www.nxp.com/investor or from the SEC website, www.sec.gov.
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