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NXP Delivers Industry's First ARM Cortex-M0 Microcontrollers With Integrated USB Drivers

NXP to Offer Global USB Vendor ID Program, mbed Support for Rapid Prototyping With LPC11U2x Series (November 29, 2011)

EINDHOVEN, NETHERLANDS and SAN JOSE, CA -- (Marketwire) -- 11/29/11 -- NXP Semiconductors N.V. (NASDAQ: NXPI) today introduced the LPC11U2x series -- the first microcontroller based on the ARM® Cortex™-M0 processor to offer integrated USB class drivers. By integrating multiple USB drivers in ROM, the LPC11U2x maximizes Flash memory utilization, saving up to 16 KB of code space while providing fully tested and easy-to-use APIs to enable USB integration in a matter of minutes. With up to 128 KB Flash and up to 4K EEPROM, the NXP LPC11U00 family of microcontrollers is designed for consumer, industrial, handheld and computing applications, and is the ideal choice for engineers looking for low-cost, easy-to-use USB solutions.

Also today, NXP announced that it will initiate a global program in which it will sub-license its USB Vendor ID (VID) and offer Product ID (PID) numbers free of charge to MCU customers. The program is an important step that eliminates a significant start-up cost for potential USB product developers. Further, to make USB development on Cortex-M0 even easier, NXP and ARM have expanded mbed, the popular rapid prototyping tool platform, to include LPC11U2x.

"Designing low-power products with USB connectivity is now simpler than ever," said Jan Jaap Bezemer, director of marketing, microcontroller business line, NXP Semiconductors. "By offering drivers in ROM, free Product IDs and easy-to-use tools with our low cost USB Cortex-M0 microcontrollers, we deliver all the key ingredients that embedded engineers need for successful USB application development."

Cortex-M0 Microcontroller with Integrated USB Drivers
The extensible on-chip USB drivers include Human Interface Device (HID), Mass Storage Device Class (MSC), and Communication Device Class (CDC). The driver capability can be further enhanced by NXP's fully featured open source USB library available on www.lpcware.com. Complementing the Cortex-M0 core, the on-chip 32-bit Divide library provides deterministic cycle time execution while executing from low-power ROM. The LPC11U00 family also offers on-chip power profiles which can be customized for any low-power application, so that designers can achieve ideal power levels in active mode with minimal application intervention.


NXP USB VID / PID Program and USB-IF Certification
To reduce time to market and overall costs, NXP is taking an important step by offering customers the option to sub-license the company's USB Vendor ID number, eliminating a significant start-up cost for USB product developers. With the LPC11U2x, NXP will also offer USB Implementers Forum (USB-IF) certification, giving users the assurance that their designs comply with the USB specification and are interoperable with existing USB solutions.

New LPC11U24 mbed Board
In addition to the highly successful LPCXpresso platform, NXP has partnered with the mbed project to create a new mbed NXP LPC11U24 microcontroller board. mbed.org, the ARM-supported rapid prototyping tool for microcontrollers, has extended support of its lightweight online compiler and powerful C/C++ microcontroller SDK to the LPC11U24, making it possible to develop USB devices in a few lines of code.

"Low-cost Cortex-M0 based microcontrollers will become one of the most attractive ways to implement USB applications," said Simon Ford, Director of Online Tools at ARM. "And with the introduction of the LPC11U24 to the mbed platform, developers can prototype these applications in minutes, backed by the resources and support shared in the mbed community."

Key Features of the LPC11U2x Series
The NXP LPC11U2x USB microcontroller series builds on and broadens the company's popular portfolio of ultra-low-power Cortex-M0 microcontrollers, and offers the following features:

  • Speeds of up to 50MHz
  • Up to 10KB SRAM and 32KB Flash
  • Up to 4KB integrated EEPROM for storing critical system data, which reduces the overall system footprint and improves security
  • Power-On-Reset (POR); multi-level Brown-Out-Detect (BOD); dedicated Phase-Locked Loop (PLL) for USB
  • Selectable USART with Smart Card Interface/UART, 2 SSP, I2C (FM+) as serial peripherals
  • 8-channel high-precision 10-bit ADC with ±1LSB DNL
  • Two 16-bit and two 32-bit timers with PWM/Match/Capture
  • 12 MHz internal RC oscillator with 1 percent accuracy over temperature and voltage

Pricing and Availability
NXP LPC11U2x microcontrollers with up to 32K Flash are currently sampling and are available from distributors worldwide. Recommended distribution unit pricing in 10,000 piece quantities for the LPC11U23FBD48/301 (48-pin LQFP package) with 24K Flash, 8K SRAM and 1K EEPROM is at US $1.53. Higher Flash options (32K - 128K) will also be available for sampling in Q1 2012.

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About NXP Semiconductors
NXP Semiconductors N.V. (NASDAQ: NXPI) provides High Performance Mixed Signal and Standard Product solutions that leverage its leading RF, Analog, Power Management, Interface, Security and Digital Processing expertise. These innovations are used in a wide range of automotive, identification, wireless infrastructure, lighting, industrial, mobile, consumer and computing applications. A global semiconductor company with operations in more than 25 countries, NXP posted revenue of $4.4 billion in 2010. Additional information can be found by visiting www.nxp.com.

Forward-looking Statements
This document includes forward-looking statements which include statements regarding NXP's business strategy, financial condition, results of operations, and market data, as well as any other statements which are not historical facts. By their nature, forward-looking statements are subject to numerous factors, risks and uncertainties that could cause actual outcomes and results to be materially different from those projected. These factors, risks and uncertainties include the following: market demand and semiconductor industry conditions; the ability to successfully introduce new technologies and products; the end-market demand for the goods into which NXP's products are incorporated; the ability to generate sufficient cash, raise sufficient capital or refinance corporate debt at or before maturity; the ability to meet the combination of corporate debt service, research and development and capital investment requirements; the ability to accurately estimate demand and match manufacturing production capacity accordingly or obtain supplies from third-party producers; the access to production capacity from third-party outsourcing partners; any events that might affect third-party business partners or NXP's relationship with them; the ability to secure adequate and timely supply of equipment and materials from suppliers; the ability to avoid operational problems and product defects and, if such issues were to arise, to correct them quickly; the ability to form strategic partnerships and joint ventures and to successfully cooperate with alliance partners; the ability to win competitive bid selection processes to develop products for use in customers' equipment and products; the ability to successfully establish a brand identity; the ability to successfully hire and retain key management and senior product architects; and, the ability to maintain good relationships with our suppliers. In addition, this document contains information concerning the semiconductor industry and NXP's business segments generally, which is forward-looking in nature and is based on a variety of assumptions regarding the ways in which the semiconductor industry, NXP's market segments and product areas may develop. NXP has based these assumptions on information currently available, if any one or more of these assumptions turn out to be incorrect, actual market results may differ from those predicted. While NXP does not know what impact any such differences may have on its business, if there are such differences, its future results of operations and its financial condition could be materially adversely affected. Readers are cautioned not to place undue reliance on these forward-looking statements, which speak to results only as of the date the statements were made. Except for any ongoing obligation to disclose material information as required by the United States federal securities laws, NXP does not have any intention or obligation to publicly update or revise any forward-looking statements after we distribute this document, whether to reflect any future events or circumstances or otherwise. For a discussion of potential risks and uncertainties, please refer to the risk factors listed in our SEC filings. Copies of our SEC filings are available from on our Investor Relations website, www.nxp.com/investor or from the SEC website, www.sec.gov.

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