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Intel Announces 1.13 GHz Notebook PC Chip

0.13-Micron Process Technology and Other Advances Drive Higher Performance and Low Power (July 30, 2001)
Intel Corporation today announced five new processors based on Intel's 0.13-micron (130 nanometer) process technology that significantly increase the capabilities of mobile PCs. The new family of Pentium III processors feature architectural enhancements to increase performance, reduce power and improve battery life. They are available in volume today at speeds up to 1.13 GHz, the industry's fastest speed for mobile processors.

Intel also announced the new highly scalable, cost effective mobile Intel 830 Chipset family. Together, the new chipset and mobile processor products enable PC makers to design high-performance notebooks that are thinner, lighter and have longer battery life.


Intel's 130-Nanometer Process Technology
By incorporating its advanced 130-nanometer process technology, Intel is able to build transistors (the switches used to create the ones and zeroes of the information age) that are the fastest in the industry. This new process technology also features high speed copper interconnects that accelerate the flow of data inside the processor, further increasing performance while consuming less power.

Processors built on Intel's 130-nanometer technology consume up to 40 percent less power and are up to 20 percent faster than the previous 180 (0.18-micron) nanometer process. Chips using Intel's 130-nanometer technology contain circuitry that is about 1/1000th the width of a human hair (1000 nanometers equal 1-micron).

The mobile Pentium III processor-M is the world's most advanced mobile processor, providing almost a 50 percent performance gain over the previous mobile Intel Pentium III processor on data intensive applications. It features several architectural advancements including: 512KB L2 cache (twice the L2 cache size of the previous generation), the new Data Prefetcher (an L2 cache enhancement that results in improved performance) and a 133-MHz processor system bus.

In addition, the processor supports Enhanced Intel SpeedStep technology that automatically switches between Maximum Performance Mode and Battery Optimized Mode based on the application demand on the processor, providing the best balance of performance and low power. The processor also uses new Intel packaging technology enabling thinner and lighter mobile PCs. The new Deeper Sleep mode provides a power reduction from previous low power sleep states to help extend battery life -- reaching power levels as low as two tenths of a watt or less -- even while running software applications.

New notebook designs based on the new processor will be available from PC makers including Acer America Corporation, Compaq Computer Corporation, Dell Computer Corporation, Fujitsu Corporation, Gateway Inc., Hewlett-Packard Company, IBM Corporation, NEC Corporation, Sony Corporation, and Toshiba America Information Systems, Inc.

Initial product offerings will be focused on full-size and thin and light mobile systems. Later this year Intel will extend the Pentium III processor-M family to include low voltage and ultra-low voltage versions, targeted for mini- and sub-notebook market segments.

New Mobile Intel 830 Chipset Family
The Intel 830 Chipset family includes three new chipsets designed to take advantage of the mobile Pentium III processor-M performance and low power characteristics. The Intel 830MP supports external graphics and is available today. Later this year Intel will provide the Intel 830M with high-performance integrated graphics, while the Intel 830MG will offer integrated graphics for lower cost systems. The new chipset uses high-performance PC-133 SDRAM, which is 33 percent faster than memory supported in the previous Intel 440BX chipset. It also includes 1GB memory support for a 50 percent increase over previous generations.

The Intel 830 Chipset also features a hub architecture that increases bandwidth and provides for a smoother and richer multimedia and Internet experience. The chipset improves connectivity and flexibility by accommodating a total of six USB ports, while integrated local area network (LAN) capability minimizes board space and reduces cost. Like the new mobile processors, the chipset integrates the new Deeper Sleep low power mode to further conserve power and help prolong battery life.

Specifications and Pricing
The five new mobile processors at speeds of 1.13 GHz, 1.06 GHz, 1.0 GHz, 933 MHz, and 866 MHz are available today. In Enhanced Speed Step automatic mode, the mobile Intel Pentium III processor-M runs at up to 1.13 GHz at 1.4 volts (Maximum Performance Mode). In Battery Optimized Mode, it runs at 733 MHz and 1.15 volts, and consumes less than 2 watts of average power. Intel will offer boxed versions of its mobile Pentium III processor-M to enable system integrators such as Asus and Clevo that configure build-to-order mobile PCs.

In 1,000-unit quantities, with either micro-flip-chip Ball Grid Array or micro-flip-chip Pin Grid Array packaging, the mobile Pentium III processor-M at 1.13 GHz, 1.06 GHz, 1.0 GHz, 933 MHz, and 866 MHz are priced at $625, $499, $394, $278 and $247, respectively. In 1,000- unit quantities, the Intel 830MP chipset is $37.50.

Other Products Based on 130-Nanometer Technology
Intel is also moving forward with plans for desktop and server processors as well as flash memory components manufactured on the 130-nanometer process. The Pentium III processor at speeds of 1.2 GHz and 1.13 GHz will soon be available for small form-factor desktop PCs.

In addition, a 1.13-GHz Intel Pentium III processor for single and dual-processor servers has been shipping since May. Several OEMs have already introduced systems based on this technology, with more expected in the third quarter. Intel also expects to release a 1.26-GHz version of the Pentium III processor for servers later this year. These products are used in systems targeting front-end, application servers and deliver a balance of performance and lower power without sacrificing reliability and availability.

Intel will be sampling its first 130-nanometer flash products later this year.

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