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Embedded Artists and NXP Release Industry's First Android Open Accessory Development Kit on ARM Cortex-M Architecture Embedded Artists and NXP Release Industry's First Android Open Accessory Development Kit on ARM Cortex-M Architecture

Gateway-Centric Design Includes Interfaces for CAN, Ethernet and 802.15.4 Wireless NetworksGateway-Centric Design Includes Interfaces for CAN, Ethernet and 802.15.4 Wireless Networks (February 28, 2012)

NUREMBERG, GERMANY -- (Marketwire) -- 02/28/12 -- At Embedded World 2012 today, Embedded Artists AB and NXP Semiconductors N.V. (NASDAQ: NXPI) introduced a powerful new Android™ Open Accessory Application (AOAA) development kit with two high-performance NXP microcontrollers based on the 32-bit ARM® Cortex™-M architecture. Featuring the NXP LPC1769 and the LPC11C24 microcontrollers, the Embedded Artists AOAA kit makes it easy for designers to develop, evaluate and prototype more complex accessories for Android smartphones and tablets. The board's unique gateway-centric design includes Ethernet, CAN and IEEE 802.15.4 interfaces as well as a remote CAN node, enabling designers to develop highly advanced accessories not only for consumer applications, but also for home, building and industrial automation applications requiring different types of connectivity.

"Our new AOAA development kit, built in collaboration with NXP, opens a new world of possibilities for Android accessory designers," said Maria Hall, managing director, Embedded Artists. "By taking advantage of one of the many connectivity options, the Android accessory is no longer simply an isolated system. Instead, it can serve as a gateway to a networked system for use in a wide range of very powerful applications."

Two High-Performance NXP Cortex-M Microcontrollers
The on-chip full-speed USB transceiver of the LPC1769, a 120-MHz Cortex-M3 based microcontroller, provides the interface to the Android mobile device. The LPC1769 also supports USB device mode, helping to "future proof" designs, should Android devices support USB host mode in the future. Other features of the LPC1769 include 512 KB flash and 64 KB on-chip SRAM; Ethernet MAC; a CAN 2.0B controller; an 8-channel, 12-bit ADC; a 10-bit DAC; digital connections including UART/SPI /I2C, numerous timers and PWMs; and low-power capabilities.

The LPC11C24 microcontroller, based on the Cortex-M0 processor, provides remote CAN node capabilities to the AOAA kit and is connected to the LPC1769 via an on-board CAN network. The LPC11C24 allows designers to develop industrial control applications using CAN, by taking advantage of control functionality for temperature, light and other sensors, which are built directly on the AOAA kit.

Extensive Software Support
Users of the Embedded Artists AOAA kit will receive all the software needed to get started with their designs including reference applications to test and build Ethernet, CAN and wireless functions. The royalty-free reference applications, which are available for download from Embedded Artists, include 1) controlling and monitoring the AOAA board from an Android device; 2) using the Android device to detect, control and monitor CAN nodes in a CAN network; and 3) using the Android device to detect, control and monitor Xbee nodes.

The AOAA kit is also a fully extensible development tool, as plug-in modules from Embedded Artists can be added quickly and easily. Further, free software support libraries are available for download at, including the emWin graphics library, nxpUSBlib, lwIP TCP/IP stack and more.

"With a majority of smartphones using Android today, the Android Open Accessory standard provides a critical link between phones, tablets and other mobile computing devices, and the embedded systems that are pervasive in our daily lives," said Gordon Cooper, international product marketing manager, microcontroller business line, NXP Semiconductors. "Building on our successful collaboration on LPCXpresso, we've worked very closely with Embedded Artists to create an easy-to-use development kit that will help to take Android accessories to the next level."

The AOAA Kit for Android is available from Embedded Artist for US $79.99 at and from NXP through approved distributors. NXP will showcase the Embedded Artists AOAA kit this week at Embedded World in Nuremberg, Germany (Hall 4A, Booth 222).


About NXP Semiconductors
NXP Semiconductors N.V. (NASDAQ: NXPI) provides High Performance Mixed Signal and Standard Product solutions that leverage its leading RF, Analog, Power Management, Interface, Security and Digital Processing expertise. These innovations are used in a wide range of automotive, identification, wireless infrastructure, lighting, industrial, mobile, consumer and computing applications. A global semiconductor company with operations in more than 25 countries, NXP posted revenue of $4.2 billion in 2011. Additional information can be found by visiting

About Embedded Artists
Embedded Artists is a leading provider of products and services around prototyping, evaluation and OEM platforms for NXP-based embedded systems. Embedded Artists' Developer's Kits, OEM boards and customization services ensure simpler and shorter design and development times, speeding up time to market and driving down costs. The company was founded in the year 2000 and is located in Sweden. For more information visit

Forward-looking Statements
This document includes forward-looking statements which include statements regarding NXP's business strategy, financial condition, results of operations, and market data, as well as any other statements which are not historical facts. By their nature, forward-looking statements are subject to numerous factors, risks and uncertainties that could cause actual outcomes and results to be materially different from those projected. These factors, risks and uncertainties include the following: market demand and semiconductor industry conditions; the ability to successfully introduce new technologies and products; the end-market demand for the goods into which NXP's products are incorporated; the ability to generate sufficient cash, raise sufficient capital or refinance corporate debt at or before maturity; the ability to meet the combination of corporate debt service, research and development and capital investment requirements; the ability to accurately estimate demand and match manufacturing production capacity accordingly or obtain supplies from third-party producers; the access to production capacity from third-party outsourcing partners; any events that might affect third-party business partners or NXP's relationship with them; the ability to secure adequate and timely supply of equipment and materials from suppliers; the ability to avoid operational problems and product defects and, if such issues were to arise, to correct them quickly; the ability to form strategic partnerships and joint ventures and to successfully cooperate with alliance partners; the ability to win competitive bid selection processes to develop products for use in customers' equipment and products; the ability to successfully establish a brand identity; the ability to successfully hire and retain key management and senior product architects; and, the ability to maintain good relationships with our suppliers. In addition, this document contains information concerning the semiconductor industry and NXP's business segments generally, which is forward-looking in nature and is based on a variety of assumptions regarding the ways in which the semiconductor industry, NXP's market segments and product areas may develop. NXP has based these assumptions on information currently available, if any one or more of these assumptions turn out to be incorrect, actual market results may differ from those predicted. While NXP does not know what impact any such differences may have on its business, if there are such differences, its future results of operations and its financial condition could be materially adversely affected. Readers are cautioned not to place undue reliance on these forward-looking statements, which speak to results only as of the date the statements were made. Except for any ongoing obligation to disclose material information as required by the United States federal securities laws, NXP does not have any intention or obligation to publicly update or revise any forward-looking statements after we distribute this document, whether to reflect any future events or circumstances or otherwise. For a discussion of potential risks and uncertainties, please refer to the risk factors listed in our SEC filings. Copies of our SEC filings are available from on our Investor Relations website, or from the SEC website,

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